CHA2090-99F Просмотр технического описания (PDF) - United Monolithic Semiconductors
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CHA2090-99F Datasheet PDF : 8 Pages
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CHA2090
17-24GHz Low Noise Amplifier
Chip Assembly and Mechanical Data
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be preferred.
2170 ± 35
2100
1295
Bonding pad positions.
( Chip thickness : 100µm. Pad size : 100x80µm² )
( All dimensions are in micrometers )
Ref. : DSCHA20909347 – 13 Dec. 99
6/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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