CF5036 Просмотр технического описания (PDF) - Nippon Precision Circuits
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CF5036 Datasheet PDF : 10 Pages
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PAD LAYOUT
(Unit: µm)
CF5036 series
OUT OUTN VCC2 OE (1100,1300)
8
7 65
Y TEST 9
DB5036
1
(0,0) VCC
234
XIN XOUT GND
X
Chip size: 1.10 × 1.30mm
Chip thickness: 300 ± 30µm
PAD size: 150µm × 100µm (VCC, OUT, OUTN pins)
100µm × 100µm (excluding VCC, OUT, OUTN pins)
Chip base: GND potential
Note: The TEST pin is not used during normal operation.
PIN DESCRIPTION and PAD DIMENSIONS
Pad No.
1
2
3
4
5
6
7
8
9
Name
VCC
XIN
XOUT
GND
OE
VCC2
OUTN
OUT
TEST
I/O
Function
–
(+) supply pin
I
Oscillator input pin
O
Oscillator output pin
–
(–) ground pin
I
Output enable pin. Outputs are high impedance when LOW (oscillator
stopped). Power-saving pull-up resistor built-in.
–
(+) output buffer supply pin
O
Output pin (complementary)
O
Output pin (true)
I
IC test pin. Leave open circuit for normal operation.
Pad dimensions [µm]
X
Y
160
130
511
130
740
130
965
130
896
1170
756
1170
523
1170
244
1170
136
678
SEIKO NPC CORPORATION —2
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