CAT24C32C5CTR(2018) Просмотр технического описания (PDF) - ON Semiconductor
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CAT24C32C5CTR Datasheet PDF : 15 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ
ISSUE A
DATE 23 MAR 2015
D
AB
L
L
ÇÇ PIN ONE
REFERENCE
ÇÇÇÇ 0.10 C
0.10 C TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
A1
SIDE VIEW
L1
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
A3
ÉÉÇÉÉÇ ÉÉÇÉÉÇÉÉÇ EXPOSEDCu
MOLD CMPD
A
A1
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.20 0.30
D
2.00 BSC
D2 1.35 1.45
E
3.00 BSC
E2 1.25 1.35
e
0.50 BSC
L 0.25 0.35
L1 −−− 0.15
GENERIC
MARKING DIAGRAM*
DETAIL A
D2
L
1
4
1
XXXXX
AWLYWG
XXXXX = Specific Device Code
E2
A
= Assembly Location
WL = Wafer Lot
Y
= Year
8
5
8X b
e
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
W
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
1.56
8X 0.68
1.45 3.40
DOCUMENT NUMBER:
DESCRIPTION:
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
98AON42552E
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
UDFN8, 2X3 EXTENDED PAD
PAGE 1 OF 1
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