BYV98 Просмотр технического описания (PDF) - Philips Electronics
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BYV98 Datasheet PDF : 8 Pages
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Philips Semiconductors
Fast soft-recovery rectifier
Product specification
BYV98
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Available in ammo-pack.
DESCRIPTION
construction. This package is
Rugged glass SOD57 package,
using a high temperature alloyed
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
2/3 pagek(Datasheet)
a
MAM047
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VRSM
VRRM
IF(AV)
IF(AV)
IFRM
IFSM
Tstg
Tj
non-repetitive peak reverse voltage
repetitive peak reverse voltage
average forward current
average forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
Ttp = 55 °C; lead length = 10 mm
see Fig. 2;
averaged over any 20 ms period;
see also Fig. 6
Tamb = 60 °C; PCB mounting (see
Fig.11); see Fig. 3;
averaged over any 20 ms period;
see also Fig. 6
Ttp = 55 °C; see Fig. 4
Tamb = 60 °C; see Fig. 5
t = 10 ms half sine wave;
Tj = Tj max prior to surge;
VR = VRRMmax
see Fig.7
MIN.
−
−
−
−
−
−
−
−65
−65
MAX.
2 100
2 000
1.00
UNIT
V
V
A
0.43 A
9.0
A
4.5
A
15
A
+175 °C
+175 °C
1996 Jun 07
2
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