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APL1085(2003) Просмотр технического описания (PDF) - Anpec Electronics

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APL1085 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
APL1085
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
<350
350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process com patibility up to and
including the stated classification temperature (this m eans Peak reflow tem perature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Carrier Tape & Reel Dimension
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
E
F
W
Po
P
D
P1
t
Bo
Ao
D1
Ko
Copyright ANPEC Electronics Corp.
10
Rev. B.5 - Jun, 2003
www.anpec.com.tw

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