AD7804 Просмотр технического описания (PDF) - Analog Devices
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AD7804 Datasheet PDF : 28 Pages
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AD7804/AD7805/AD7808/AD7809
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V + 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to DVDD + 0.3 V
Analog Input Voltage to AGND . . . . . –0.3 V to AVDD + 0.3 V
COMP to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
REF OUT to AGND . . . . . . . . . . . . . . . . . . –0.3 V to + AVDD
REF IN to AGND . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
VOUT to AGND2 . . . . . . . . . . . . . . . . –0.3 V to AVDD + 0.3 V
Input Current to Any Pin Except Supplies3 . . . . . . . . ± 10 mA
Operating Temperature Range
AD7804/AD7805 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
AD7808/AD7809 Commercial Plastic
(B, C Versions) . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
SOIC (R-16) Package, Power Dissipation . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-16) Package, Power Dissipation . . . . . . . . . 670 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC (R-24) Package, Power Dissipation . . . . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-24) Package, Power Dissipation . . . . . . . . . 670 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC (R-28) Package, Power Dissipation . . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PDIP (N-28) Package, Power Dissipation . . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SSOP (RS-28) Package, Power Dissipation . . . . . . . . 875 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 110°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
TQFP (SU-44) Package, Power Dissipation . . . . . . 450 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 116°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2The outputs may be shorted to voltages in this range provided the power dissipation
of the package is not exceeded.
3Transient currents of up to 100 mA will not cause SCR latch-up.
Model
AD7804BN
AD7804BR
AD7805BN
AD7805BR
AD7805BRS
AD7805CR
AD7808BN
AD7808BR
AD7809BST
Supply
Voltage
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
3.3 V to 5 V
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
ORDERING GUIDE
Relative
Accuracy
± 3 LSB
± 3 LSB
± 3 LSB
± 3 LSB
± 3 LSB
± 3 LSB
± 4 LSB
± 4 LSB
± 4 LSB
Package Descriptions
16-Lead Plastic DIP
16-Lead Small Outline IC
28-Lead Plastic DIP
28 Lead Small Outline IC
28-Lead Shrink Small Outline Package
28-Lead Small Outline IC
24-Lead Plastic DIP
24 Lead Small Outline IC
44-Lead Thin Plastic Quad Flatpack (TQFP)
Package
Options
N-16
R-16
N-28
R-28
RS-28
R-28
N-24
R-24
SU-44
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–6–
REV. A
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