Philips Semiconductors
Product specification
UHF power LDMOS transistor
BLF861A
THERMAL CHARACTERISTICS
SYMBOL
Rth j-mb
Rth mb-h
PARAMETER
CONDITIONS
thermal resistance from junction to mounting base Tmb = 25 °C; Ptot = 318 W
thermal resistance from mounting base to heatsink
VALUE
0.55
0.2
UNIT
K/W
K/W
CHARACTERISTICS
Tj = 25 °C; per section; unless otherwise specified.
SYMBOL
V(BR)DSS
VGSth
IDSS
IDSX
IGSS
gfs
RDSon
Ciss
Coss
Crss
PARAMETER
drain-source breakdown voltage
gate-source threshold voltage
drain-source leakage current
drain cut-off current
gate leakage current
forward transconductance
drain-source on-state resistance
input capacitance
output capacitance
feedback capacitance
CONDITIONS
MIN.
VGS = 0; ID = 1.5 mA
65
VDS = 10 V; ID = 150 mA
4
VGS = 0; VDS = 32 V
−
VGS = VGSth + 9 V; VDS = 10 V
18
VGS = ±15 V; VDS = 0
−
VDS = 10 V; ID = 4 A
−
VGS = VGSth + 9 V; ID = 4 A
−
VGS = 0; VDS = 32 V; f = 1 MHz (1) −
VGS = 0; VDS = 32 V; f = 1 MHz (1) −
VGS = 0; VDS = 32 V; f = 1 MHz (1) −
TYP.
−
−
−
−
−
4
160
82
40
6
MAX. UNIT
−
V
5.5 V
2.2 µA
−
A
25
nA
−
S
−
mΩ
−
pF
−
pF
−
pF
Note
1. Capacitance values without internal matching.
100
handbook, halfpage
Coss
(pF)
80
MLD510
60
40
20
0
0
10
20
30
40
50
VDS (V)
VGS = 0; f = 1 MHz; Tj = 25 °C.
Fig.2 Output capacitance as a function of
drain-source voltage; typical values per
section.
2001 Feb 09
3