BD4746G-TR Просмотр технического описания (PDF) - ROHM Semiconductor
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BD4746G-TR Datasheet PDF : 8 Pages
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BD47□□G series
Technical Note
Operation Notes
1. Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2. GND potential
GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if,
include transient feature.
3. Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
4. Bypass Capacitor for Noise Rejection
Please put into the capacitor between VCC pin and GND, to reject noise. If extremely big capacitor is used, transient
response might be late. Please confirm sufficiently for the point.
5. Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VCC pin, Output pin and GND pin, or VCC pin and GND pin. When soldering the
IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed
between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak
resistance.
7. External parameters
The recommended parameter range for RL is 2kΩ~1MΩ. There are many factors (board layout, etc) that can affect
characteristics. Please verify and confirm using practical applications.
8. Power on reset operation
Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation.
9. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be
certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
10. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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2010.04 - Rev.C
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