BCM847 Просмотр технического описания (PDF) - Philips Electronics

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Компоненты Описание

производитель

BCM847

NPN/NPN matched double transistors

Philips Electronics 

Philips Semiconductors

11. Soldering

BCM847BV/BS/DS

NPN/NPN matched double transistors

2.00

1.70

1.00

0.55

(2×)

2.75

2.45

2.10

1.60

0.15

(4×)

0.40

(6×)

0.30 (2×)

0.375

(4×)

0.075

solder lands

solder resist

1.20

2.20

2.50

placement area

occupied area

Dimensions in mm

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint SOT666

2.65

0.60

(2×)

2.35

solder lands

solder paste

0.50

(4×)

solder resist

occupied area

Dimensions in mm

0.50

(4×)

1.20

2.40

Fig 15. Reflow soldering footprint SOT363 (SC-88)

0.40

(2×)

0.90

2.10

sot363

BCM847BV_BS_DS_5

Product data sheet

Rev. 05 — 27 June 2006

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

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