BC846BPN Просмотр технического описания (PDF) - NXP Semiconductors.
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BC846BPN Datasheet PDF : 12 Pages
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NXP Semiconductors
BC846BS
65 V, 100 mA NPN/NPN general-purpose transistor
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Per device
Ptot
Tj
Tamb
Tstg
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
[1] -
-
−55
−65
Max Unit
300
mW
150
°C
+150 °C
+150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
500
Ptot
(mW)
400
006aab618
300
200
100
0
−75
−25
25
75
125
175
Tamb (°C)
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve SOT363 (SC-88)
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
Per device
Rth(j-a)
thermal resistance from
junction to ambient
Conditions
in free air
in free air
Min Typ Max
[1] -
-
625
-
-
230
[1] -
-
416
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Unit
K/W
K/W
K/W
BC846BS_1
Product data sheet
Rev. 01 — 24 August 2009
© NXP B.V. 2009. All rights reserved.
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