BC327T/R Просмотр технического описания (PDF) - NXP Semiconductors.
Номер в каталоге
Компоненты Описание
производитель
BC327T/R Datasheet PDF : 19 Pages
| |||
NXP Semiconductors
8. Package outline
Plastic surface-mounted package; 3 leads
BC807; BC807W; BC327
45 V, 500 mA PNP general-purpose transistors
SOT23
D
B
E
A
X
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45 0.55
0.15 0.45
0.2
0.1
OUTLINE
VERSION
SOT23
REFERENCES
IEC
JEDEC
JEITA
TO-236AB
Fig 13. Package outline SOT23 (TO-236AB)
BC807_BC807W_BC327_6
Product data sheet
Rev. 06 — 17 November 2009
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
© NXP B.V. 2009. All rights reserved.
11 of 19
Share Link: 