AV2132 Просмотр технического описания (PDF) - APLUS INTEGRATED CIRCUITS
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производитель
AV2132 Datasheet PDF : 11 Pages
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Bonding Diagram
Y
VSS PWM2 PWM1
VDD
AVXX32E-B SERIES
(1) AV2132E
PIN Name
OKY_RW3
RW2_OPA
RW1_OPB
TG3_OPC
TG2_OPD
TEST
OSC
TG1
DAC
TG0
VSS
PWM2
PWM1
VDD
(2) AV3232E
PIN Name
OKY_RW3
RW2_OPA
RW1_OPB
TG3_OPC
TG2_OPD
TEST
OSC
TG1
DAC
TG0
VSS
PWM2
PWM1
VDD
DAC
OSC
RW2_OPA
TG0
TG1
TG3_OPC
TEST
OKY_RW3 RW1_OPB TG2_OPD
X
Note: The IC substrate should be connect to VSS
X(mm)
250.75
451.50
660.25
861.00
1069.75
1270.25
94.00
1313.25
94.00
1313.25
410.75
631.00
1049.50
1331.00
Y(mm)
94.00
94.25
94.25
94.25
94.25
94.25
271.25
297.00
472.25
501.00
1419.50
1440.00
1440.00
1440.00
DIE SIZE = 1510 * 1655 Pm^2 (X*Y)
X(mm)
250.75
451.50
660.25
861.00
1069.75
1270.25
94.00
1313.25
94.00
1313.25
410.75
631.00
1049.50
1331.00
Y(mm)
94.00
94.25
94.25
94.25
94.25
94.25
271.25
297.00
472.25
501.00
1649.50
1670.00
1670.00
1670.00
DIE SIZE = 1510 * 1885 Pm^2 (X*Y)
10-9
Ver. 1.0
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