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TK70403MTB/03J Просмотр технического описания (PDF) - Toko America Inc

Номер в каталоге
Компоненты Описание
производитель
TK70403MTB/03J
Toko
Toko America Inc  Toko
TK70403MTB/03J Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
TK70403
DEFINITION AND EXPLANATION OF TECHNICAL TERMS (CONT.)
CL = 0.47 µF
CL = 2.2 µF
CL = 4.7 µF
CL = 0.68 µF
0
50
TIME (µs)
REDUCTION OF OUTPUT NOISE
Although the architecture of the Toko regulators is designed
to minimize semiconductor noise, further reduction can be
achieved by increasing the size of the output capacitor. A
more effective solution would be to add a capacitor to the
noise bypass terminal. The value of the capacitor should
be at least 0.1 µF or higher (higher values provide greater
noise reduction). Although stable operation is possible
without the noise bypass capacitor, this terminal has a high
impedance and care should be taken to avoid a large
circuit area on the printed circuit board when the capacitor
is not used. Please note that several parameters are
affected by the value of the capacitors and bench testing
is recommended when deviating from standard values.
thermal conductivity, the junction temperature will be low
even if the power dissipation is great. When mounted on
the recommended mounting pad, the power dissipation of
the SOT-26 is increased to 350 mW. For operation at
ambient temperatures over 25 °C, the power dissipation of
the SOT-26 device should be derated at 2.8 mW/°C. To
determine the power dissipation for shutdown when
mounted, attach the device on the actual PCB and
deliberately increase the output current (or raise the input
voltage) until the thermal protection circuit is activated.
Calculate the power dissipation of the device by subtracting
the output power from the input power. These
measurements should allow for the ambient temperature
of the PCB. The value obtained from PD /(150 °C - TA) is the
derating factor. The PCB mounting pad should provide
maximum thermal conductivity in order to maintain low
device temperatures. As a general rule, the lower the
temperature, the better the reliability of the device. The
thermal resistance when mounted is expressed as follows:
Tj = 0jA x PD + TA
For Toko ICs, the internal limit for junction temperature is
150 °C. If the ambient temperature (TA) is 25 °C, then:
150 °C = 0jA x PD + 25 °C
0jA = 125 °C/ PD
INPUT AND OUTPUT CAPACITORS
Toko regulators require an output capacitor in order to
maintain regulator loop stability. The capacitor value should
be at least 0.68 µF over actual ambient operating
temperature.
PD is the value when the thermal sensor is activated. A
simple way to determine PD is to calculate VIN x IIN when
the output side is shorted. Input current gradually falls as
temperature rises. You should use the value when thermal
equilibrium is reached.
PACKAGE POWER DISSIPATION (PD)
This is the power dissipation level at which the thermal
sensor is activated. The IC contains an internal thermal
sensor which monitors the junction temperature. When
the junction temperature exceeds the monitor threshold of
150 °C, the IC is shut down. The junction temperature
rises as the difference between the input power (VIN x IIN)
and the output power (VOUT x IOUT) increases. The rate of
temperature rise is greatly affected by the mounting pad
configuration on the PCB, the board material, and the
ambient temperature. When the IC mounting has good
January 1999 TOKO, Inc.
Page 7

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