AS1154_V2 Просмотр технического описания (PDF) - austriamicrosystems AG

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AS1154_V2

Dual LVDS Driver

austriamicrosystems AG 

AS1154

Datasheet - Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Electrical Parameters

VCC to GND

INx to GND

OUTx+, OUTx- to GND

Short Circuit Duration (OUTx+, OUTx-)

Electrostatic Discharge

Electrostatic Discharge HBM

Continous Power Dissipation (TA = +70°C)

Continous Power Dissipation

Continous Power Dissipation Derating Factor

Temperature Ranges and Storage Conditions

Junction Temperature

Storage Temperature Range

Package Body Temperature

Humidity non-condensing

Moisture Sensitive Level

Min

Max Units

Comments

-0.3

5.0

V

-0.3 Vcc + 0.3 V

-0.3

5.0

V

Continuous

+/- 4

kV Norm: MIL 883 E method 3015, INx, OUTx+, OUTx-

755

mW

9.4 mW / °C

PT1 for 8-pin SOIC Package

PDERATE2

+150

-55

+125

+260

5

85

1

ºC

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

ºC

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

%

Represents a max. floor life time of unlimited

1. Depending on actual PCB layout and PCB used.

2. PDERATE derating factor changes the total continuous power dissipation (PT) if the ambient temperature is not 70ºC. Therefore for e.g.

TA=85ºC calculate PT at 85ºC = PT - PDERATE x (85ºC - 70ºC)

www.austriamicrosystems.com/Interfaces-LVDS/AS1154

Revision 1.02

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