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AS1113 Просмотр технического описания (PDF) - austriamicrosystems AG

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AS1113
AmsAG
austriamicrosystems AG AmsAG
AS1113 Datasheet PDF : 24 Pages
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AS1113
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical
Characteristics on page 5 is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max Units
Comments
VDD to GND
Input Voltage
0
7
V
-0.4
VDD
+0.4
V
Output Voltage
-0.4
15
V
GND Pin Current
1000 mA
Thermal Resistance ΘJA
88 ºC/W
23 ºC/W
on PCB, 24-pin SSOP package
on PCB, 28-pin QFN (5x5mm) package
Ambient Temperature
-40
Storage Temperature
-55
Humidity
5
Electrostatic
Discharge
Digital Outputs
All Other Pins
+85 ºC
150 ºC
86
%
2000
V
2000
Non-condensing
Norm: MIL 833 E method 3015
Latch-Up Immunity
Package Body Temperature
-100 - +100 +
(INOM x 0.5) INOM
mA
EIA/JESD78
+260
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020C “Moisture/Reflow
ºC Sensitivity Classification for Non-Hermetic Solid
State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
www.austriamicrosystems.com
Revision 1.00
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