APW7128 Просмотр технического описания (PDF) - Anpec Electronics
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APW7128 Datasheet PDF : 16 Pages
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APW7128
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN
VIN pin to GND
-0.3 to 30
V
VLX
LX pin to PGND
-0.3 to 30
V
VOVP
OVP pin to GND
-0.3 to 30
V
VBP
BP pin to GND
-0.3 to 6
V
VEN
EN pin to GND
-0.3 to 30
V
VALS
ALS pin to GND
PGND to GND
-0.3 to 6
V
-0.3 to 0.3
V
TJ
Maximum Junction Temperature
150
°C
TSTG
Storage Temperature Range
-65 to 150
°C
TL
Maximum Lead Soldering Temperature, 10 Seconds
260
°C
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction to Ambient Thermal Resistance in Free Air (Note 2)
DFN3x3-10
Typical Value
80
Unit
°C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
is soldered directly on the PCB.
Recommended Operating Conditions
Symbol
VIN
VOUT
TJ
TA
Parameter
VIN Supply Voltage, (VIN=BP)
VIN Supply Voltage, (BP is open)
Output Voltage
Operating Ambient Temperature
Operating Junction Temperature
Range
Unit
2.7 to 5.5
V
3.7 to 21V
V
up to 30
V
-40 to 85
°C
-40 to 125
°C
Electrical Characteristics
VIN=6V, TA = -40 to 85°C, unless otherwise specified. Typical values refer to TA =25°C.
Symbol
Parameter
Test Conditions
APW7128
Unit
Min.
Typ.
Max.
INPUT SUPPLY CURRENT AND UVLO
BP Under Voltage Lockout Threshold VIN rising
UVLO Hysteresis
2.4
2.5
2.6
V
-
100
-
mV
IVIN
VIN Supply Current
EN=5V, switching
EN=0V
-
9
15
mA
-
-
1
µA
Copyright © ANPEC Electronics Corp.
2
Rev. A.2 - Aug., 2010
www.anpec.com.tw
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