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APTGF350SK60G Просмотр технического описания (PDF) - Microsemi Corporation

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Компоненты Описание
производитель
APTGF350SK60G
Microsemi
Microsemi Corporation Microsemi
APTGF350SK60G Datasheet PDF : 6 Pages
1 2 3 4 5 6
APTGF350SK60G
Thermal and package characteristics
Symbol Characteristic
RthJC Junction to Case Thermal Resistance
IGBT
Diode
VISOL
TJ
TST G
TC
Torque
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
To heatsink
M6
For terminals
M5
Wt Package Weight
Min Typ Max Unit
0.08 °C/W
0.16
2500
V
-40
150
-40
125 °C
-40
100
3
2
5
3.5
N.m
280 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com
www.microsemi.com
3-6

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