HM4-6617B883 Просмотр технического описания (PDF) - Intersil

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производитель

HM4-6617B883

2K x 8 CMOS PROM

Intersil 

Die Characteristics

DIE DIMENSIONS:

140 x 232 x 19 ± 1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ± 15kÅ

Metallization Mask Layout

A3

A2

HM-6617/883

GLASSIVATION:

Type: SiO2

Thickness: 7kÅ ± 9kÅ

WORST CASE CURRENT DENSITY:

1.7 x 105 A/cm2

HM-6617/883

A4 A5

A6 A7 VCC A8 A9

P

G

A10

A1

E

A0

Q7

Q0

Q1 Q2 GND Q3 Q4

Q5 Q6

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