APL3208A Просмотр технического описания (PDF) - Anpec Electronics
Номер в каталоге
Компоненты Описание
производитель
APL3208A Datasheet PDF : 17 Pages
| |||
APL3208A/B/C
Ordering and Marking Information
APL3208A
APL3208B
APL3208C
APL3208A QB:
L08A
X
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QB : TDFN2x2-8 CT : TSOT-23-6A
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
X - Date Code
APL3208B QB:
L08B
X
X - Date Code
APL3208C QB:
L08C
X
X - Date Code
APL3208A CT:
L8AX
X - Date Code
APL3208B CT:
L8BX
X - Date Code
APL3208C CT:
L8CX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VACIN
ACIN Input Voltage (ACIN to GND)
-0.3 ~ 30
V
VCHG_DET
VCHG_SW
CHG_DET to GND Voltage
CHG_SW to GND Voltage
-0.3 ~ 7
V
-0.3 ~ VCHG_DET
V
VBAT
VBAT to GND Voltage
-0.3 ~ 7
V
VOUT
OUT to GND Voltage
-0.3 ~ 7
V
IOUT
OUT Output Current
1.5
A
TJ
Maximum Junction Temperature
150
oC
TSTG
Storage Temperature
-65 ~ 150
oC
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
oC
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
TDFN2x2-8
TSOT-23-6A
Typical Value
80
235
Unit
oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of TDFN2x2-8 is soldered directly on the PCB.
Copyright © ANPEC Electronics Corp.
2
Rev. A.2 - Nov., 2009
www.anpec.com.tw
Share Link: 