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AO4818B Просмотр технического описания (PDF) - Unspecified

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производитель
AO4818B
SHENZHENFREESCALE
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AO4818B Datasheet PDF : 6 Pages
1 2 3 4 5 6
AO4818B
30V Dual N-channel MOSFET
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min Typ Max Units
STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage
ID=250µA, VGS=0V
30
V
IDSS
Zero Gate Voltage Drain Current
VDS=30V, VGS=0V
TJ=55°C
1
µA
5
IGSS
Gate-Body leakage current
VDS=0V, VGS=±20V
10 µA
VGS(th) Gate Threshold Voltage
VDS=VGS ID=250µA
1.2 1.8 2.4
V
ID(ON)
On state drain current
VGS=10V, VDS=5V
48
A
RDS(ON) Static Drain-Source On-Resistance
VGS=10V, ID=8A
TJ=125°C
15.5 19
m
21
25
VGS=4.5V, ID=6A
18.5 26 m
gFS
Forward Transconductance
VDS=5V, ID=8A
30
S
VSD
Diode Forward Voltage
IS=1A,VGS=0V
0.75 1
V
IS
Maximum Body-Diode Continuous Current
2.5
A
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VGS=0V, VDS=15V, f=1MHz
VGS=0V, VDS=0V, f=1MHz
600 740 888 pF
77 110 145 pF
50
82 115 pF
0.5 1.1 1.7
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge
12
15
18
nC
Qg(4.5V) Total Gate Charge
Qgs
Gate Source Charge
VGS=10V, VDS=15V, ID=8A
6
7.5
9
nC
2.5
nC
Qgd
Gate Drain Charge
3
nC
tD(on)
Turn-On DelayTime
5
ns
tr
Turn-On Rise Time
VGS=10V, VDS=15V, RL=1.8,
3.5
ns
tD(off)
Turn-Off DelayTime
RGEN=3
19
ns
tf
Turn-Off Fall Time
3.5
ns
trr
Body Diode Reverse Recovery Time IF=8A, dI/dt=500A/µs
6
8
10
ns
Qrr
Body Diode Reverse Recovery Charge IF=8A, dI/dt=500A/µs
14
18
22
nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
2/6
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