AMMC-5026 Просмотр технического описания (PDF) - HP => Agilent Technologies
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AMMC-5026 Datasheet PDF : 8 Pages
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89
750
(Vd)
(Aux Vd)
840 505
(±10 µm)
252
2964
(RF Output Pad)
587
318
(Aux Vg2)
89 (RF Input Pad)
3050 (± 10 µm)
Figure 16. AMMC-5026 Bonding Pad Locations. (dimensions in micrometers)
2323 2563
2951
(Vg1) (Aux Vg1)
Notes:
All dimensions in microns.
Rectangular Pad Dim: 75 x 75 µm
1.5 mil dia.Gold Wire Bond
to ≥15 nF DC Feedthru
4 nH Inductor
(1.0 mil Gold Wire Bond
with length of 200 mils)
≥68 pF Capacitor
Gold Plated Shim
2.0 mil
nom. gap
Input and Output Thin Film
Circuit with ≥8 pF
DC Blocking Capacitor
Vd
HMMC-5026 OUT
IN
Vg
2.0 mil
nom. gap
0.7 mil dia. Gold Bond Wire
(Length Not important)
Figure 17. AMMC-5026 Assembly Diagram.
Bonding Island
1.5 mil dia.Gold Wire Bond
to ≥15 nF DC Feedthru
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For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
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Hong Kong: (65) 6756 2394
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0120-61-1280(Domestic Only)
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Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
April 6, 2004
5988-9882EN
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