AMMC-5023 Просмотр технического описания (PDF) - HP => Agilent Technologies
Номер в каталоге
Компоненты Описание
производитель
AMMC-5023 Datasheet PDF : 9 Pages
| |||
600
520
RF INPUT
300
80
0
0
VG1
VD1
435
755
VG2
1235
VD2
1555
Figure 21. AMMC-5023 Bonding Pad Locations. (dimensions in micrometers)
RF OUTPUT
300
VG2 (Y-axis)
105
0
1880
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
July 31, 2003
5988-9883EN
Share Link: 