AMMC-5618 Просмотр технического описания (PDF) - HP => Agilent Technologies
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AMMC-5618 Datasheet PDF : 8 Pages
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0 143 355 573
Vd1 GND Vd2
920
530
RF
530
RF
0
Vg1
0
Vg2
0 79
593
920
Figure 20. AMMC-5618 Bond pad locations (dimensions in microns)
Ordering Information:
AMMC-5618-W10 = waffle pack, 10 devices per tray
AMMC-5618-W50 = waffle pack, 50 devices per tray
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
February 12, 2004
5989-0532EN
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