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Компоненты Описание

производитель

AM29LV010B

1 Megabit (128 K x 8-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory

Advanced Micro Devices 

DATA SHEET

TABLE OF CONTENTS

Distinctive Characteristics 3

General Description 4

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV010B Device Bus Operations .............................. 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

Output Disable Mode .............................................................. 11

Table 2. Am29LV010B Uniform Sector Address Table................... 11

Autoselect Mode ..................................................................... 12

Table 3. Am29LV010B Autoselect Codes....................................... 12

Sector Protection/Unprotection ............................................... 12

Hardware Data Protection ...................................................... 12

Command Definitions . . . . . . . . . . . . . . . . . . . . . 13

Reading Array Data ................................................................ 13

Reset Command ..................................................................... 13

Autoselect Command Sequence ............................................ 13

Byte Program Command Sequence ....................................... 13

Figure 1. Program Operation ..........................................................14

Chip Erase Command Sequence ........................................... 14

Sector Erase Command Sequence ........................................ 15

Erase Suspend/Erase Resume Commands ........................... 15

Figure 2. Erase Operation ...............................................................16

Command Definitions ............................................................. 17

Table 4. Am29LV010B Command Definitions ................................ 17

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 18

DQ7: Data# Polling ................................................................. 18

Figure 3. Data# Polling Algorithm ...................................................18

DQ6: Toggle Bit I .................................................................... 19

DQ2: Toggle Bit II ................................................................... 19

Reading Toggle Bits DQ6/DQ2 ............................................... 19

Figure 4. Toggle Bit Algorithm ........................................................ 20

DQ5: Exceeded Timing Limits ................................................ 20

DQ3: Sector Erase Timer ....................................................... 20

Table 5. Write Operation Status..................................................... 21

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 22

Figure 5. Maximum Negative Overshoot Waveform ...................... 22

Figure 6. Maximum Positive Overshoot Waveform ........................ 22

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 7. ICC1 Current vs. Time (Showing Active and Automatic

Sleep Currents) .............................................................................. 24

Figure 8. ICC1 vs. Frequency .......................................................... 24

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 9. Test Setup ....................................................................... 25

Table 6. Test Specifications ........................................................... 25

Key to Switching Waveforms. . . . . . . . . . . . . . . . 25

Figure 10. Input Waveforms and Measurement Levels ................. 25

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26

Read Operations .................................................................... 26

Figure 11. Read Operations Timings ............................................. 26

Erase/Program Operations ..................................................... 27

Figure 12. Program Operation Timings .......................................... 28

Figure 13. Chip/Sector Erase Operation Timings .......................... 29

Figure 14. Data# Polling Timings (During Embedded Algorithms) . 30

Figure 15. Toggle Bit Timings (During Embedded Algorithms) ...... 30

Figure 16. DQ2 vs. DQ6 ................................................................. 31

Figure 17. Alternate CE# Controlled Write Operation Timings ...... 32

Erase and Programming Performance . . . . . . . . 32

Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 33

TSOP Pin Package Capacitance . . . . . . . . . . . . . 33

PLCC Pin Capacitance . . . . . . . . . . . . . . . . . . . . . 33

Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 34

PL 032—32-Pin Plastic Leaded Chip Carrier ......................... 34

TS 032—32-Pin Standard Thin Small Outline Package ......... 35

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 36

October 11, 2006 22140D6

Am29LV010B

5

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