AM29F010-1 Просмотр технического описания (PDF) - Advanced Micro Devices
Номер в каталоге
Компоненты Описание
производитель
AM29F010-1
Advanced Micro Devices
AM29F010-1 Datasheet PDF : 8 Pages
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PAD DESCRIPTION
SUPPLEMENT
Pad
Signal
Pad Center (mils)
X
Y
Pad Center (millimeters)
X
Y
1
VCC
0.00
0.00
0.00
0.00
2
A16
–33.20
–1.30
–0.84
–0.03
3
A15
–41.60
–1.30
–1.06
–0.03
4
A12
–49.90
–1.30
–1.27
–0.03
5
A7
–58.30
–1.30
–1.48
–0.03
6
A6
–66.60
–1.30
–1.69
–0.03
7
A5
–75.00
–1.30
–1.91
–0.03
8
A4
–74.40
–10.50
–1.89
–0.27
9
A3
–75.60
–158.20
–1.92
–4.02
10
A2
–69.40
–166.80
–1.76
–4.24
11
A1
–56.10
–166.80
–1.42
–4.24
12
A0
–46.10
–166.80
–1.17
–4.24
13
D0
–36.30
–166.90
–0.92
–4.24
14
D1
–25.90
–166.90
–0.66
–4.24
15
D2
–13.30
–166.90
–0.34
–4.24
16
VSS
–4.30
–166.90
–0.11
–4.24
17
D3
4.70
–166.90
0.12
–4.24
18
D4
17.30
–166.90
0.44
–4.24
19
D5
27.60
–166.90
0.70
–4.24
20
D6
40.20
–166.90
1.02
–4.24
21
D7
50.60
–166.90
1.29
–4.24
22
CE#
60.60
–166.80
1.54
–4.24
23
A10
74.00
–166.80
1.88
–4.24
24
OE#
81.40
–158.20
2.07
–4.02
25
A11
80.20
–10.40
2.04
–0.26
26
A9
80.80
–1.30
2.05
–0.03
27
A8
72.40
–1.30
1.84
–0.03
28
A13
64.10
–1.30
1.63
–0.03
29
A14
55.70
–1.30
1.41
–0.03
30
WE#
47.40
–1.30
1.20
–0.03
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
4
Am29F010 Known Good Die
1/13/98
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