AH420
4W High Linearity InGaP HBT Amplifier
Application Circuit PC Board Layout
Baseplate Configuration
Circuit Board Material: 0.014” GETEK, single layer, 1 oz copper, εr = 4.2,
Microstrip line details: width = .030”, marker spacing = .050”
Notes:
1. Please note that for reliable operation, the evaluation board will have to be mounted to a
much larger heat sink during operation and in laboratory environments to dissipate the
power consumed by the device. The use of a convection fan is also recommended in
laboratory environments.
2. The area around the module underneath the PCB should not contain any soldermask in
order to maintain good RF grounding.
Specifications and information are subject to change without notice.
TriQuint Semiconductor Inc • Phone 1-503-615-9000 • FAX: 503-615-8900 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com
Page 2 of 9 July 2010