AH118(2006) Просмотр технического описания (PDF) - WJ Communications => Triquint
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AH118 Datasheet PDF : 8 Pages
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AH118
¼ Watt, High Linearity InGaP HBT Amplifier
AH118-89G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“AH118G” designator with an alphanumeric
lot code on the top surface of the package.
The obsolete tin-lead package is marked with
an “AH118” or “E099” designator followed
by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
MSL / ESD Rating
ESD Rating: Class 1A
Value:
Passes between 250 and 500V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Thermal Specifications
MTTF vs. GND Tab Temperature
100000
Parameter
Rating
Operating Case Temperature (1) -40 to +85 °C
10000
Thermal Resistance (2), Rth
92 °C / W
Junction Temperature (3), Tj
159 °C
Notes:
1. The amplifier can be operated at 105 °C case temperature for up to 1000
hours over its lifetime without degradation in performance and will not
degrade device operation at the recommended maximum 85 °C case
temperature for the rest of its lifetime.
2. The thermal resistance is referenced from the junction-to-case at a case
temperature of 85 °C.
3. This corresponds to the typical biasing condition of +5V, 160 mA at an
85°C case temperature. A minimum MTTF of 1 million hours is achieved
for junction temperatures below 247 °C.
1000
100
60
70 80 90 100 110 120
Tab Temperature (°C)
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
Page 8 of 8 December 2006
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