ADXL375 Просмотр технического описания (PDF) - Analog Devices

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ADXL375

3-Axis, ±200 g Digital Accelerometer

Analog Devices 

Data Sheet

SOLDERING PROFILE

Figure 2 and Table 4 provide information about the recommended soldering profile.

TP

TL

TSMAX

TSMIN

tP

RAMP-UP

CRITICAL ZONE

TL TO TP

tL

tS

PREHEAT

RAMP-DOWN

t25°C TO PEAK

TIME

Figure 2. Recommended Soldering Profile

Table 4. Recommended Soldering Profile Limits1, 2

Profile Feature

Sn63/Pb37

Average Ramp Rate (TL to TP)

3°C/sec maximum

Preheat

Minimum Temperature (TSMIN)

100°C

Maximum Temperature (TSMAX)

150°C

Time from TSMIN to TSMAX (tS)

60 sec to 120 sec

Ramp-Up Rate (TSMAX to TL)

3°C/sec maximum

Liquidous Temperature (TL)

183°C

Time Maintained Above TL (tL)

60 sec to 150 sec

Peak Temperature (TP)

240°C +0°C/−5°C

Time Within 5°C of Actual TP (tP)

10 sec to 30 sec

Ramp-Down Rate

6°C/sec maximum

Time 25°C (t25°C) to Peak Temperature

6 minutes maximum

Pb-Free

3°C/sec maximum

150°C

200°C

60 sec to 180 sec

3°C/sec maximum

217°C

60 sec to 150 sec

260°C +0°C/−5°C

20 sec to 40 sec

6°C/sec maximum

8 minutes maximum

1 Based on JEDEC Standard J-STD-020D.1.

2 For best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used.

ADXL375

Rev. 0 | Page 5 of 32

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