ADT75(RevB) Просмотр технического описания (PDF) - Analog Devices
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ADT75 Datasheet PDF : 24 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
VDD to GND
SDA Input Voltage to GND
SDA Output Voltage to GND
SCL Input Voltage to GND
OS/ALERT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
8-Lead MSOP (RM-8)
Power Dissipation1, 2
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
8-Lead SOIC (R-8)
Power Dissipation1, 2
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
θJC, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Rating
–0.3 V to +7 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–0.3 V to VDD + 0.3 V
–55°C to +150°C
–65°C to +160°C
150.7°C
WMAX = (TJMAX − TA)/θJA
205.9°C/W
43.74°C/W
WMAX = (TJMAX − TA)/θJA
157°C/W
56°C/W
220°C (0°C/5°C)
10 sec to 20 sec
3°C/sec maximum
–6°C/sec maximum
6 minutes maximum
260°C (+0°C)
20 sec to 40 sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA and θJC. Refer to Figure 3 for a plot of maximum power
dissipation vs. ambient temperature (TA).
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
ADT75
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.2
1.0
0.8
0.6
0.4
0.2
MAX PD = 3.4mW AT 150°C
0
TEMPERATURE (°C)
Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 7 of 24
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