ADT7408CCPZ-REEL7(RevA) Просмотр технического описания (PDF) - Analog Devices

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ADT7408CCPZ-REEL7
(Rev.:RevA)

±2°C Accurate, 12-Bit Digital Temperature Sensor

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

VDD to VSS

SDA Input Voltage to VSS

SDA Output Voltage to VSS

SCL Input Voltage to VSS

EVENT# Output Voltage to VSS

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature, TJMAX

Thermal Resistance1

θJA, Junction-to-Ambient (Still Air)

IR Reflow Soldering Profile

Rating

−0.3 V to +7 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−0.3 V to VDD + 0.3 V

−55°C to +150°C

−65°C to +160°C

150°C

85°C/W

Refer to Figure 3

1 Power Dissipation PMAX = (TJMAX − TA)/θJA, where TA is the ambient

temperature. Thermal resistance value relates to the package being used on

a standard 2-layer PCB, which gives a worst-case θJA. Some documents may

publish junction to case, thermal resistance θJC, but it refers to a component

that is mounted on an ideal heat sink. As a result, junction to ambient,

thermal resistance is more practical for air cooled, PCB mounted

components.

ADT7408

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

RAMP UP

3°C/SECOND MAX

60 – 150 SECONDS

217°C

260 – 5/+0°C

150°C – 200°C

RAMP DOWN

6°C/SECOND

MAX.

TIME (Seconds)

60 – 180 SECONDS

480 SECONDS MAX.

20 – 40 SECONDS

Figure 3. LFCSP Pb-Free Reflow Profile Based on JEDEC J-STD-20C

ESD CAUTION

Rev. A | Page 5 of 22

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