ADNS-2051 Просмотр технического описания (PDF) - HP => Agilent Technologies
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ADNS-2051 Datasheet PDF : 40 Pages
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HDNS-2200 (CLIP)
HLMP-ED80-XXXXX (LED)
ADNS-2051 (SENSOR)
CUSTOMER SUPPLIED PCB
HDNS-2100 (LENS)
CUSTOMER SUPPLIED BASE PLATE
WITH RECOMMENDED ALIGNMENT
FEATURES PER IGES DRAWING
Figure 5. Exploded view drawing.
PCB Assembly Considerations
1. Insert the sensor and all
other electrical components
into PCB.
2. Bend the LED leads 90° and
then insert the LED into the
assembly clip until the snap
feature locks the LED base.
3. Insert the LED/clip assembly
into PCB.
4. Wave Solder the entire as-
sembly in a no-wash solder
process utilizing solder fix-
ture. The solder fixture is
needed to protect the sensor
during the solder process.
The fixture should be de-
signed to expose the sensor
leads to solder while shield-
ing the optical aperture from
direct solder contact. The
solder fixture is also used to
set the reference height of
the sensor to the PCB top
during wave soldering (Note:
DO NOT remove the kapton
tape during wave soldering).
5. Place the lens onto the base
plate.
6. Remove the protective
kapton tape from optical
aperture of the sensor. Care
must be taken to keep con-
taminants from entering the
aperture. It is recommended
not to place the PCB facing
up during the entire mouse
assembly process. The PCB
should be held vertically
during the kapton removal
process.
7. Insert PCB assembly over the
lens onto the base plate align-
ing post to retain PCB assem-
bly. The sensor aperture ring
should self-align to the lens.
8. The optical position refer-
ence for the PCB is set by the
base plate and lens. Note that
the PCB motion due to button
presses must be minimized to
maintain optical alignment.
9. Install mouse top case. There
MUST be a feature in the top
case to press down onto the
clip to ensure all components
are interlocked to the correct
vertical height.
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