ADN2891 Просмотр технического описания (PDF) - Analog Devices
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ADN2891 Datasheet PDF : 16 Pages
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ADN2891
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Data Sheet
AVCC 1
PIN 2
NIN 3
AVEE 4
ADN2891
TOP VIEW
(Not to Scale)
12 DRVCC
11 OUTP
10 OUTN
9 DRVEE
NOTES
1. THE LFCSP HAS AN EXPOSED PAD ON THE BOTTOM. TO
IMPROVE HEAT DISSIPATION, THE EXPOSED PAD MUST
BE SOLDERED TO THE GND PLANE WITH FILLED VIAS.
Figure 2. Pin Configuration
Note that the LFCSP has an exposed pad on the bottom. To improve heat dissipation, the exposed pad must be soldered to the GND plane
with filled vias.
Table 4. Pin Function Descriptions
Pin No.
Mnemonic
I/O Type1
1
AVCC
P
2
PIN
AI
3
NIN
AI
4
AVEE
P
5
THRADJ
AO
6
CAZ1
AI
7
CAZ2
AI
8
LOS
DO
9
DRVEE
P
10
OUTN
DO
11
OUTP
DO
12
DRVCC
P
13
SQUELCH
DI
14
RSSI_OUT
AO
15
PD_VCC
P
16
PD_CATHODE
AO
Exposed Pad
P
Pad
Descriptions
Analog Power Supply.
Differential Data Input, Positive Port, 50 Ω On-Chip Termination.
Differential Data Input, Negative Port, 50 Ω On-Chip Termination.
Analog Ground.
LOS Threshold Adjust Resistor.
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for
input offset correction.
LOS Detector Output, Open Collector.
Output Buffer Ground.
Differential Data Output, CML, Negative Port, 50 Ω On-Chip Termination.
Differential Data Output, CML, Positive Port, 50 Ω On-Chip Termination.
Output Buffer Power Supply.
Disable Outputs, 100 kΩ On-Chip Pull-Down Resistor.
Average Current Output.
Power Input for RSSI Measurement.
Photodiode Bias Voltage.
Connect to Ground.
1 P = power; DI = digital input; DO = digital output; AI = analog input; and AO = analog output.
Rev. B | Page 6 of 16
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