ADN2880 Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

ADN2880

3.2 Gbps, 3.3 V, Low Noise, Transimpedance Amplifier

Analog Devices 

ASSEMBLY RECOMMENDATIONS

Coplanar PIN Photodiode for SDH/SONET

VPD

VCC

CA

OUTB

CPD

CB

OUT

ADN2880

Dual Planar PIN/APD Photodiode for SDH/SONET

VPD

VCC

CA

OUTB

CPD

PD

CB

OUT

Figure 18. 5-Pin TO-46 with External Photodiode Supply VPD

Connected Through the FILTER Pin

VCC

B.W B.W.

CB

VPD B.W. B.W.

CPD

B.W.

FILTER

B.W.

IN

200Ω

VCC

50Ω

50Ω

B.W.

B.W.

OUT

OUTB

20pF

0.85V

RSSI

GND

B.W.

B.W.

GND

CAP

B.W.

Figure 19. Equivalent Circuit of the Assembly Including Bond Wires

Table 4. Bill of Materials (BOM)

Component Description

PD

1× vendor specific, 2.5 Gbps, photodiode

TIA

1× ADN2880 (0.7 mm × 1.2 mm), 3.2 Gbps,

transimpedance amplifier

CB

1× 200 pF, RF single-layer capacitor

CPD

1× 560 pF, RF single-layer capacitor

CA

1× 1000 pF, ceramic capacitor (optional for SDH)

Figure 20. 5-Pin TO-46 with External Photodiode Supply VPD to

a Dual Planar PIN or APD

VCC

B.W B.W.

CB

VPD B.W.

CPD

B.W. IN

200Ω

VCC

50Ω

50Ω

B.W.

B.W.

OUT

OUTB

20pF

0.85V

RSSI

GND

B.W.

B.W.

GND

CAP

B.W.

Figure 21. For Dual Planar PDs, No Connection to FILTER Pin

Notes

One mil thickness, gold wire, ball bond recommended.

Minimize all GND bond-wire lengths.

Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.

Maintain symmetry in length and orientation between OUT

and OUTB bond wires.

Maintain symmetry in length and orientation between IN and

FILTER bond wires.

Maintain symmetry between IN/FILTER and OUT/OUTB

bond wires.

Rev. 0 | Page 9 of 12

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