ADN2880 Просмотр технического описания (PDF) - Analog Devices
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ADN2880 Datasheet PDF : 12 Pages
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PIN Photodiode for Non-SDH/SONET Applications
VCC
OUTB
CB
SC
OUT
ADN2880
OUTB
VCC
SC
CB
OUT
Figure 26. Coplanar PIN for a 4-Pin TO-46
VCC B.W.
CB
B.W.
B.W.
VCCFILTER VCC
B.W.
FILTER
B.W. IN
200Ω
50Ω 50Ω
B.W.
B.W.
OUT
OUTB
20pF
0.85V
RSSI
GND
B.W.
GND CAP
B.W.
Figure 27. Equivalent Circuit with Bond Wires, as Shown in Figure 26
Table 6. Bill of Materials (BOM)
Component Description
PD
1× vendor specific, 2.5 Gbps, photodiode
TIA
1× ADN2880 (0.7 mm × 1.2 mm), 3.2 Gbps,
transimpedance amplifier
CB
1× 200 pF, RF single-layer capacitor
Sc
1× ceramic standoff or 1× optional 1000 pF
capacitor
Figure 28. Dual Planar PIN for a 4-Pin TO-46
ADN2880 PD
SC
CB
TO CAN HEADER
Figure 29. Side View of the Assembly, as Shown in Figure 26
Notes
One mil thickness, gold wire, ball bond recommended.
Minimize all GND bond-wire lengths.
Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.
Maintain symmetry in length and orientation between OUT
and OUTB bond wires.
Maintain symmetry in length and orientation between IN and
FILTER bond wires.
Maintain symmetry between IN/FILTER and OUT/OUTB
bond wires.
Rev. 0 | Page 11 of 12
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