ADN2849ACP-RL7 Просмотр технического описания (PDF) - Analog Devices
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ADN2849ACP-RL7 Datasheet PDF : 17 Pages
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ADN2849
PAD CONFIGURATION AND FUNCTION DESCRIPTION
25 24 23
22 21 20 19 19
Preliminary Technical Data
1
18
17
2
16
3
ADN2849
4
4
15
5
6
14
13
26 7 8 9 10
11 12 27
Figure 16. Pad configuration
(Die size 2.05×2.05mm, single bond pad size 84×84µm with 76×76µm glass opening, double bond pad size 184×84µmwith 176×76µm)
Notes:
1. The metallization photograph and the die pad coordinates appear at the end of this document.
2.The pads that have the same number must be bonded together.
3. The back side of the die must be connected to the most negative supply rail of the ADN2849
Table 6.
Pad number
1, 10, 11, 14,17, 20, 25, 26, 27
2
3
4
5
6
7
8
9
12, 13, 21
15
16
18, 19
22
23
24
Mnemonic
GND
DATAP
DATAN
VBB
CLKP
CLKN
MOD_ENB
CLK_SELB
MOD_SET
VEE
MODN_TERM
MODP
VTERM
BIAS_SET
CPAP
CPAN
Description
Positive power supply
AC coupled CML data, positive differential terminal
AC coupled CML data, negative differential terminal
CML termination resistor
AC coupled CML clock, positive differential terminal
AC coupled CML clock, negative differential terminal
Modulation enable logic input
Retiming select logic input
Modulation voltage set input
Negative power supply
Termination resistor for MODN
Positive modulation voltage output
Back termination voltage output
Bias offset voltage set input
Cross point adjust positive control input
Cross point adjust negative control input
Rev. Pr. G | Page 8 of 17
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