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ADM1029ARQZ

Dual PWM Fan Controller and Temperature Monitor for High Availability Systems

ON Semiconductor 

ADM1029

Parameter

Min Typ Max

Unit

Test Conditions/Comments

SERIAL BUS TIMING5 (continued)

SCL Low Time, tLOW

SCL High Time, tHIGH

SCL, SDA Rise Time, tR

SCL, SDA Fall Time, tF

Data Setup Time, tSU:DAT

Data Hold Time, tHD:DAT

1.3

µs

See Figure 1

4

50

µs

See Figure 1

1000

ns

See Figure 1

300

ns

See Figure 1

250

ns

See Figure 1

300

ns

See Figure 1

NOTES

1All voltages are measured with respect to GND, unless otherwise specified.

2Typicals are at TA = 25°C and represent most likely parametric norm. Shutdown current typ is measured with V CC = 3.3 V.

3TUE (Total Unadjusted Error) includes Offset, Gain, and Linearity errors of the ADC, multiplexer.

4The total fan count is based on two pulses per revolution of the fan tachometer output.

5Timing specifications are tested at logic levels of VIL = 0.8 V for a falling edge and VIH = 2.1 V for a rising edge.

Specifications subject to change without notice.

ABSOLUTE MAXIMUM RATINGS*

Positive Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . 6.5 V

Voltage on Pins 13–18 . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V)

Voltage on Any Other Input or Output Pin . . . . –0.3 V to +6.5 V

Input Current at Any Pin . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA

Package Input Current . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA

Maximum Junction Temperature (TJ max) . . . . . . . . . . 150°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200°C

ESD Rating All Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

THERMAL CHARACTERISTICS

24-Lead QSOP Package:

θJA = 105°C/W, θJC = 39°C/W

PIN CONFIGURATION

DRIVE1 1

24 DRIVE2

FAULT1 2

23 FAULT2

TACH1 3

22 TACH2

PRESENT1 4

21 PRESENT2

SCL 5

20 AIN1/GPIO1

SDA 6

GND 7

VCC 8

CFAULT 9

INT 10

ADM1029

TOP VIEW

(Not To Scale)

19 AIN0/GPIO0

18 TMIN/INSTALL

17 D2+/GPIO6

16 D2–/GPIO5

15 ADD

GPIO2 11

14 D1+/GPIO4

RESET 12

13 D2–/GPIO3

SCL

tR

tLOW

tHD;STA

tHD;DAT

tF

tHIGH

tSU;DAT

tHD;STA

tSU;STA

SDA

tBUF

P

S

S

Figure 1. Diagram for Serial Bus Timing

tSU;STO

P

Rev. 1 | Page 3 of 50 | www.onsemi.com

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