AD9433(RevA) Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

AD9433
(Rev.:RevA)

12-Bit, 105 MSPS/125 MSPS, IF Sampling ADC

Analog Devices 

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

AD9433

52 51 50 49 48 47 46 45 44 43 42 41 40

GND 1

VCC 2

GND 3

GND 4

VCC 5

VCC 6

ENCODE 7

ENCODE 8

GND 9

VCC 10

GND 11

DGND 12

VDD 13

PIN 1

AD9433

TOP VIEW

(Not to Scale)

39 GND

38 GND

37 VCC

36 VCC

35 GND

34 GND

33 GND

32 VDD

31 DGND

30 D0 (LSB)

29 D1

28 D2

27 D3

14 15 16 17 18 19 20 21 22 23 24 25 26

NOTES

1. THE EXPOSED PADDLE ON THE UNDERSIDE OF THE PACKAGE MUST

BE SOLDERED TO THE GROUND PLANE. SOLDERING THE EXPOSED

PADDLE TO THE PCB INCREASES THE RELIABILITY OF THE SOLDER

JOINTS, MAXIMIZING THE THERMAL CAPABILITY OF THE PACKAGE.

Figure 3. Pin Configuration

Table 6. Pin Function Descriptions

Pin No.

Mnemonic

1, 3, 4, 9, 11, 33,

34, 35, 38, 39, 40,

43, 48, 51

GND

2, 5, 6, 10, 36, 37, VCC

44, 47, 52

7

ENCODE

8

ENCODE

12, 21, 24, 31

DGND

13, 22, 23, 32

VDD

14

OR

15 to 20, 25 to 30 D11 to D6, D5 to D0

41

DFS

42

SFDR MODE

45

VREFIN

46

VREFOUT

49

AIN

50

AIN

Exposed Pad (EP)

Description

Analog Ground.

Analog Supply (5 V).

Encode Clock for ADC, Complementary.

Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.

Digital Output Ground.

Digital Output Power Supply (3 V).

Out-of-Range Output.

Digital Output.

Data Format Select. Logic low = twos complement, logic high = offset binary; floats low.

CMOS Control Pin. This pin enables SFDR mode, a proprietary circuit that can improve the SFDR

performance of the AD9433. SFDR mode is useful in applications where the dynamic range of

the system is limited by discrete spurious frequency content caused by nonlinearities in the

ADC transfer function. Set this pin to 0 for normal operation; floats low.

Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.

Internal Reference Output (2.5 V Typical).

Analog Input, True.

Analog Input, Complementary.

The exposed paddle on the underside of the package must be soldered to the ground plane.

Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximiz-

ing the thermal capability of the package.

Rev. A | Page 7 of 20

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