24.5-29.5GHz LNA VGA
Chip Assembly and Mechanical Data
CHA2293
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bond Pad:100 x 100 µm
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHA22931201 -20-July-01
6/7
Specifications subject to change without notice
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