AD5821 Просмотр технического описания (PDF) - Analog Devices

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AD5821

120 mA, Current Sinking, 10-Bit, I2C® DAC

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 4.

Parameter

VDD to AGND

VDD to DGND

AGND to DGND

SCL, SDA to DGND

XSHUTDOWN to DGND

ISINK to AGND

Operating Temperature Range

Industrial (B Version)

Storage Temperature Range

Junction Temperature (TJ MAX)

WLFCSP Power Dissipation

θJA Thermal Impedance1

Mounted on 4-Layer Board

Lead Temperature, Soldering

Maximum Peak Reflow Temperature2

Rating

–0.3 V to +5.5 V

–0.3 V to VDD + 0.3 V

–0.3 V to +0.3 V

–0.3 V to VDD + 0.3 V

–0.3 V to VDD + 0.3 V

–0.3 V to VDD + 0.3 V

−30°C to +85°C

−65°C to +150°C

150°C

(TJ MAX − TA)/θJA

95°C/W

260°C (±5°C)

1 To achieve the optimum θJA, it is recommended that the AD5821

be soldered on a 4-layer board.

2 As per JEDEC J-STD-020C.

AD5821

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

Rev. 0 | Page 5 of 16

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