AD5317BRU-REEL Просмотр технического описания (PDF) - Analog Devices

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Компоненты Описание

производитель

AD5317BRU-REEL

2.5 V to 5.5 V, 400
A, Quad Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP

Analog Devices 

AD5307/AD5317/AD5327

ABSOLUTE MAXIMUM RATINGS1, 2

(TA = 25∞C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V

Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V

Reference Input Voltage to GND . . . . –0.3 V to VDD + 0.3 V

VOUTA–VOUTD to GND . . . . . . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (A, B Versions) . . . . . . . . . . . . –40∞C to +105∞C

Storage Temperature Range . . . . . . . . . . . . –65∞C to +150∞C

Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . 150∞C

16-Lead TSSOP

Power Dissipation . . . . . . . . . . . . . . . . . . (TJ max – TA)/␪JA

␪JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4∞C/W

Reflow Soldering

Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C

Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Transient currents of up to 100 mA will not cause SCR latch-up.

Model

AD5307ARU

AD5307ARU-REEL 7

AD5307BRU

AD5307BRU-REEL

AD5307BRU-REEL7

AD5317ARU

AD5317ARU-REEL7

AD5317BRU

AD5317BRU-REEL

AD5317BRU-REEL7

AD5327ARU

AD5327ARU-REEL7

AD5327BRU

AD5327BRU-REEL

AD5327BRU-REEL7

Temperature Range

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

–40∞C to +105∞C

ORDERING GUIDE

Package Description

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Package Option

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

RU-16

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD5307/AD5317/AD5327 feature proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

–6–

REV. A

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