ACPM-7331-TR1 Просмотр технического описания (PDF) - Avago Technologies
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ACPM-7331-TR1 Datasheet PDF : 18 Pages
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PCB Design Guidelines
0.1
0.6
The recommended ACPM-7331 PCB land pattern is shown
in Figure 18 and Figure 19. The substrate is coated with
solder mask between the I/O and conductive paddle to 0.4
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 20. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.85
0.25
Figure 18. Metallization
0.7
0.5
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
0.85
2.4
Figure 19. Solder Mask Opening
0.6
0.4
0.5
1.6
0.85
2.0
Figure 20. Solder Paste Stencil Aperture
11
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