DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

A3955 Просмотр технического описания (PDF) - Allegro MicroSystems

Номер в каталоге
Компоненты Описание
производитель
A3955 Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
A3955
Full-Bridge PWM Microstepping Motor Driver
Description (continued)
Internal circuit protection includes thermal shutdown with hysteresis,
transient-suppression diodes, and crossover-current protection.
Special power-up sequencing is not required.
The A3955 is supplied in a choice of two power packages; a 16-pin
dual-in-line plastic package with copper heat-sink tabs (suffix ‘B’),
Selection Guide
Part Number
A3955SB-T
A3955SLB-T
A3955SLBTR-T
Packing
16-pin DIP with exposed thermal tabs
16-pin SOICW with internally fused pins
16-pin SOICW with internally fused pins
and a 16-lead plastic SOIC with internally fused pins (suffix ‘LB’).
For both package styles, the thermally enhanced pins are at ground
potential and need no electrical isolation. Both packages are lead
(Pb) free, with leadframe plating 100% matte tin.
Package
25 per tube
47 per tube
1000 per reel
Absolute Maximum Ratings
Characteristic
Load Supply Voltage
Logic Supply Voltage
Logic/Reference Input Voltage Range
Sense Voltage
Output Current, Continuous
Package Power Dissipation
Operating Ambient Temperature
Maximum Junction Temperature
Storage Temperature
Symbol
VBB
VCC
VIN
VS
IOUT
PD
TA
TJ(max)
Tstg
Notes
Output current rating may be limited by duty cycle, ambient
temperature, and heat sinking. Under any set of conditions, do
not exceed the specied current rating or a junction tempera-
ture of 150°C.
Range S
Fault conditions that produce excessive junction temperature
will activate the device’s thermal shutdown circuitry. These
conditions can be tolerated but should be avoided.
Rating
50
7.0
–0.3 to VCC + 0.3
1.0
±1.5
See graph
–20 to 85
150
–55 to 150
Units
V
V
V
V
mA
W
ºC
ºC
ºC
Thermal Characteristics
Characteristic
Symbol
Test Conditions*
Package Thermal Resistance, Junction
to Ambient
Package Thermal Resistance, Junction
to Tab
B Package, single-layer PCB, 1 in2. 2-oz. exposed copper
RθJA
LB Package, 2-layer PCB, 0.3 in2. 2-oz. exposed copper each
side
RθJT
*Additional thermal information available on Allegro website.
Value
43
67
6
4
R θJT = 6.0°C/W
3
SUFFIX 'B', RθJA = 43°C/W
2
Units
ºC/W
ºC/W
ºC/W
1
SUFFIX 'LB', R θJA = 67°C/W
0
25
50
75
100
125
150
TEMPERATURE IN °C
Allegro MicroSystems, Inc.
2
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]