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74ACTQ541 Просмотр технического описания (PDF) - Fairchild Semiconductor

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74ACTQ541 Datasheet PDF : 9 Pages
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Physical Dimensions (Continued)
Figure 4. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1993 Fairchild Semiconductor Corporation
74ACTQ541 Rev. 1.6.0
8
www.fairchildsemi.com

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