Philips Semiconductors
N-channel enhancement mode vertical
D-MOS transistor
Product specification
BSP152
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
VDS
±VGSO
ID
IDM
Ptot
Tstg
Tj
drain-source voltage
gate-source voltage
DC drain current
peak drain current
total power dissipation
storage temperature
operating junction temperature
open drain
up to Tamb = 25 °C; note 1
MIN.
−
−
−
−
−
−65
−
MAX. UNIT
200 V
40 V
550 mA
3
A
1.5 W
+150 °C
150 °C
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth j-a
from junction to ambient; note 1
83.3 K/W
Note
1. Device mounted on an epoxy printed-circuit board, 40 x 40 x 1.5 mm, mounting pad for the drain tab minimum 6 mm2.
STATIC CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
V(BR)DSS
±IGSS
VGS(th)
RDS(on)
IDSS
| Yfs|
Ciss
drain-source breakdown voltage
gate-source leakage current
gate-source threshold voltage
drain-source on-resistance
drain-source leakage current
transfer admittance
input capacitance
Coss
output capacitance
Crss
feedback capacitance
Switching times (see Figs 2 and 3)
ton
turn-on time
toff
turn-off time
CONDITIONS
MIN. TYP. MAX. UNIT
ID = 10 µA; VGS = 0
±VGS = 40 V; VDS = 0
ID = 1 mA; VDS = VGS
ID = 750 mA; VGS = 10 V
VDS = 160 V; VGS = 0
ID = 750 mA; VDS = 25 V
VDS = 25 V; VGS = 0;
200 −
−
V
−
−
100 nA
1.5 −
3.5 V
−
−
2.5 Ω
−
−
100 nA
400 −
−
mS
−
100 −
pF
f = 1 MHz
VDS = 25 V; VGS = 0; f = 1 MHz −
42 −
pF
VDS = 25 V; VGS = 0; f = 1 MHz −
8
−
pF
ID = 750 mA; VDD = 50 V;
VGS = 0 to 10 V
ID = 750 mA; VDD = 50 V;
VGS = 10 to 0 V
−
−
15 ns
−
−
30 ns
April 1995
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