MC33886PVWR2 Просмотр технического описания (PDF) - Freescale Semiconductor

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MC33886PVWR2

5.0 A H-Bridge

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

Supply Voltage

Input Voltage (1)

FS Status Output (2)

Continuous Current (3)

ESD Voltage for VW Package

Human Body Model (4)

Machine Model (5)

V+

VIN

V FS

IOUT

VESD1

VESD2

40

V

-0.1 to 7.0

V

7.0

V

5.0

A

V

±2000

±200

Storage Temperature

Ambient Operating Temperature (6)

Operating Junction Temperature

Peak Package Reflow Temperature During Reflow (7), (8)

Approximate Junction-to-Board Thermal Resistance (and Package

Dissipation = 6.0 W) (9)

TSTG

TA

TJ

TPPRT

RθJB

-65 to 150

-40 to 125

-40 to 150

Note 7.

~5.0

°C

°C

°C

°C

°C/W

Notes

1. Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.

2. Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.

3. Continuous current capability so long as junction temperature is ≤ 150°C.

4. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).

5. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.

7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RθJB (junction-to-PC board)

values will vary depending on solder thickness and composition and copper trace.

33886

4

Analog Integrated Circuit Device Data

Freescale Semiconductor

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