2N7002BKMB Просмотр технического описания (PDF) - NXP Semiconductors.
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2N7002BKMB Datasheet PDF : 15 Pages
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NXP Semiconductors
10. Soldering
Footprint information for reflow soldering
2N7002BKMB
60 V, single N-channel Trench MOSFET
1.3
0.7
R0.05 (8x)
SOT883B
0.9
0.25
(2x)
0.3
(2x)
0.3
0.4
(2x)
0.4
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
Fig 20. Reflow soldering footprint for SOT883B (DFN1006B-3)
0.6 0.7
sot883b_fr
2N7002BKMB
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 13 June 2012
© NXP B.V. 2012. All rights reserved.
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