ADG774 Просмотр технического описания (PDF) - Analog Devices
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ADG774 Datasheet PDF : 12 Pages
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ADG774
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . 149.97°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
Model
ADG774BR
ADG774BR-REEL
ADG774BR-REEL7
ADG774BRZ*
ADG774BRZ-REEL*
ADG774BRZ-REEL7*
ADG774BRQ
ADG774BRQ-REEL
ADG774BRQ-REEL7
ADG774BRQZ*
ADG774BRQZ-REEL*
ADG774BRQZ-REEL7*
*Z = Pb-free part.
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
ORDERING GUIDE
Package Descriptions
Standard Small Outline Package (SOIC)
Standard Small Outline Package (SOIC)
Standard Small Outline Package (SOIC)
Standard Small Outline Package (SOIC)
Standard Small Outline Package (SOIC)
Standard Small Outline Package (SOIC)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Package Options
R-16
R-16
R-16
R-16
R-16
R-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
RQ-16
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG774 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. C
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