TGA8226 Просмотр технического описания (PDF) - TriQuint Semiconductor
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TGA8226 Datasheet PDF : 8 Pages
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RECOMMENDED
ASSEMBLY DIAGRAM
DC-Coupled Circuit
Product Data Sheet
TGA8226-SCC
RF connections: Bond using 1-mil diameter, 15-mil-length gold bond wires at both RF Input and RF Output
for optimum RF performance.
Close placement of external components is essential to stability.
Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed
during handling, assembly and test.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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