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1N5822UB1(2009) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
1N5822UB1
(Rev.:2009)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
1N5822UB1 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Ordering information
1N5822U
3
Ordering information
Table 7. Ordering information(1)
Order code
ESCC detailed
specification
Package
Lead finish
Marking EPPL Weight Packing
1N5822UB1
1N5822U01B
1N5822U02B
-
TBD(2)
TBD(2)
Gold plated 22UB1 - 0.18 g
LCC2B
Gold plated 22U01B
Y
Waffle
0.18 g pack
Solder dip 22U02B Y
1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q
versions.
2. TBD: to be defined upon ESCC qualification
4
Revision history
Table 8. Document revision history
Date
Revision
10-Aug-2009
1
First issue.
Changes
6/7
Doc ID 16007 Rev 1

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