SST31LF021 Просмотр технического описания (PDF) - Silicon Storage Technology
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SST31LF021 Datasheet PDF : 24 Pages
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2 Mbit Flash + 1 Mbit SRAM ComboMemory
SST31LF021 / SST31LF021E
EOL Data Sheet
TABLE 4: SOFTWARE COMMAND SEQUENCE
Command
Sequence
1st Bus
Write Cycle
2nd Bus
Write Cycle
3rd Bus
Write Cycle
4th Bus
Write Cycle
5th Bus
Write Cycle
6th Bus
Write Cycle
Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data Addr1 Data
Byte-Program
5555H AAH 2AAAH 55H 5555H A0H BA2 Data
Sector-Erase
Bank-Erase
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SAX3 30H
5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H
Software ID Entry4,5 5555H AAH 2AAAH 55H 5555H 90H
Software ID Exit
5555H AAH 2AAAH 55H 5555H F0H
1. Address format A14-A0 (Hex),Address A15, A16, and A17 can be VIL or VIH, but no other value, for the Command sequence.
2. BA = Program Byte address
3. SAX for Sector-Erase; uses A17-A12 address lines
4. The device does not remain in Software Product ID mode if powered down.
5. With A17-A1 = 0; SST Manufacturer’s ID = BFH, is read with A0 = 0,
SST31LF021 Device ID = 18H, is read with A0 = 1,
SST31LF021E Device ID = 19H, is read with A0 = 1
T4.4 1137
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20°C to +85°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VDD+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to VDD+1.0V
Package Power Dissipation Capability (Ta = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0W
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
OPERATING RANGE: SST31LF021/021E
Range
Commercial
Extended
Ambient Temp
0°C to +70°C
-20°C to +85°C
VDD
3.0-3.6V
3.0-3.6V
AC CONDITIONS OF TEST
Input Rise/Fall Time . . . . . . . . . . . . . . . 5 ns
Output Load . . . . . . . . . . . . . . . . . . . . . CL = 30 pF
See Figures 14 and 15
©2007 Silicon Storage Technology, Inc.
8
S71137-06-EOL
05/07
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